Method of manufacturing electronic part

Details Method of manufacturing electronic part Method of manufacturing electronic part

2005-03-07

2010-12-07

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S833000, C029S840000

Reexamination Certificate

active

07845071

ABSTRACT:
The present invention provides a substrate holding method capable of contributing to improvement in performance of an electronic part. A plastic film is adhered to a holding frame by using an adhesive tape having a proper gas releasing characteristic such that total quantity of gas detected when analysis using gas chromatograph mass spectrometry (dynamic HS-GC-MS) is conducted under test conditions of 180° C. and 10 minutes is 100.5 μg/g or less in n-tetradecane. In the case where the plastic film held by the holding frame is subjected to a process of manufacturing an electronic part (for example, a solar battery), even when a process accompanying generation of heat during the manufacturing process (for example, a film forming process such as plasma CVD) is performed on the plastic film, a release amount of unnecessary gas released from the adhesive tape due to the influence of the heat is suppressed, so that deterioration in the performance of the electronic part caused by the unnecessary gas is suppressed.

REFERENCES:
patent: 2002/0037605 (2002-03-01), Ninomiya et al.
patent: 2005/0058167 (2005-03-01), Kuramachi et al.
patent: 02-244772 (1990-09-01), None
patent: A-8-316300 (1996-11-01), None
patent: A-10-12910 (1998-01-01), None
patent: A 2002-100790 (2002-04-01), None
Sep. 30, 2009 Office Action issued in JP2004-087279.

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