Method of manufacturing electronic packaging device with...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S592100, C029S602100, C029S827000, C029S855000, C029S860000, C336S090000, C336S192000, C361S728000, C361S773000

Reexamination Certificate

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06912781

ABSTRACT:
A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.

REFERENCES:
patent: 3721747 (1973-03-01), Renskers
patent: 5008776 (1991-04-01), Queyssac
patent: 5015981 (1991-05-01), Lint et al.
patent: 5977860 (1999-11-01), Ulm et al.
patent: 6005463 (1999-12-01), Lint et al.
patent: 6344785 (2002-02-01), Lu et al.
patent: 6593840 (2003-07-01), Morrison et al.
patent: 6691398 (2004-02-01), Gutierrez

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