Method of manufacturing electronic module assembly

Details Method of manufacturing electronic module assembly Method of manufacturing electronic module assembly

1992-02-18

1992-11-03

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29835, 439 67, 439 72, 439492, H05K 330

Patent

active

051597519

ABSTRACT:
An electronic module assembly (31) is provided by assembling components (17) to a planar polyimide flex circuit film (14) laminated to an aluminum rigidizer plate (11). The flex circuit film and rigidizer are then bent by a sheet metal bending process such that the rigidizer plate forms an exterior protective housing and the components are provided in an interior space (30). Connector pins (23) provide external electrical access to the components and circuit patterns (15, 16, 19) on the film (14). Structures (24, 25, 29) mate with the bent plate and substantially enclose the interior space. Module cost is reduced since the existing flex circuit rigidizer plate is used to form part of the module housing, and economical planar component assembly techniques are utilized while eliminating the step of mounting the flex circuit rigidizer plate to an external module housing. Two techniques for using a mandrel shaft (26, 35) to bend the plate (11) without stressing the film (14) are disclosed.

REFERENCES:
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patent: 4811165 (1989-03-01), Currier et al.
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patent: 5007842 (1991-04-01), Deak et al.
patent: 5026291 (1991-06-01), David
patent: 5044980 (1991-09-01), Krumme et al.

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