Method of manufacturing electronic device

Details Method of manufacturing electronic device Method of manufacturing electronic device

2005-02-28

2011-11-15

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S830000, C029S417000, C310S311000, C310S348000

Reexamination Certificate

active

08056198

ABSTRACT:
A master substrate15having a plurality of substrate areas A arranged in a matrix shape is prepared, and a piezoelectric oscillation element5is carried in each of the substrate areas A. A main cover16made of a metal having a plurality of cover areas B having a one-to-one correspondence with the substrate areas A is placed and joined on the master substrate15. The main cover16is together cut along the outer periphery B′ of each of the cover areas B, to simultaneously obtain a plurality of electronic devices. The productivity can be improved by simplifying the assembling steps.

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Japanese language office action and its English language translation for corresponding Japanese application 2004108878.

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