Method of manufacturing electronic device

Details Method of manufacturing electronic device Method of manufacturing electronic device

2005-08-18

2008-03-25

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

C216S039000, C216S057000, C216S067000, C216S109000, C134S003000, C438S963000, C252S079300, C252S079400

Reexamination Certificate

active

07347951

ABSTRACT:
A method of manufacturing an electronic device comprises forming a wiring material layer made of aluminum or an aluminum alloy on the surface of an insulating film on a substrate, patterning the wiring material layer by a reactive ion etching treatment with a resist pattern used as a mask so as to form a wiring, and treating the surface of the insulating film including the wiring with an aqueous solution for removing the etching residue, the aqueous solution containing a peroxosulfate, a fluorine-containing compound and an acid for adjusting the pH value and having a pH value of −1 to 3.

REFERENCES:
patent: 4851148 (1989-07-01), Yamasoe et al.
patent: 4857225 (1989-08-01), Terada et al.
patent: 5254156 (1993-10-01), Nakaso et al.
patent: 2002/0001887 (2002-01-01), Sung et al.
patent: 6-349791 (1994-12-01), None
patent: 11-243085 (1999-09-01), None
patent: 2000-82739 (2000-03-01), None
patent: 2000-277522 (2000-10-01), None
patent: 2001-247986 (2001-09-01), None
patent: 2001-308054 (2001-11-01), None

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