Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
1998-07-30
2002-08-20
Gulakowski, Randy (Department: 1746)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S095000, C216S101000, C216S103000, C216S106000, C216S108000, C215S002000, C215S002000
Reexamination Certificate
active
06436300
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates, in general, to electronics, and more particularly, to methods of manufacturing electronic components.
Metal layers of titanium and tungsten are commonly used as barrier layers in electronic components. In particular, semiconductor components use these barrier layers to prevent metallic ions from diffusing into and contaminating the underlying semiconductor substrate. Hydrogen peroxide has been used to etch these barrier layers for over twenty-eight years. Many improvements have been made to the hydrogen peroxide etch process. However, the etch process is still difficult to control in certain situations.
Accordingly, a need exists for an improved method of etching metal layers to manufacture electronic components.
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Carney George F.
Carney, Jr. Francis J.
Mitchell Douglas G.
Powell Cary B.
Woolsey Eric J.
Gulakowski Randy
Motorola Inc.
Olsen Allan
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