Method of manufacturing electronic component package, and...

Details Method of manufacturing electronic component package, and... Method of manufacturing electronic component package, and...

2011-04-19

2011-04-19

Nguyen, Thanh (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C227S059000, C227S059000

Reexamination Certificate

active

07927920

ABSTRACT:
In a method of manufacturing an electronic component package, first, there is fabricated a wafer incorporating a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages, and a retainer for retaining the plurality of sets of external connecting terminals, the wafer including a plurality of pre-base portions that will be separated from one another later to be bases of the electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chips are connected to the external connecting terminals. Next, the electronic component chips are sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed.

REFERENCES:
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patent: A 2001-35993 (2001-02-01), None
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Japanese Office Action in Japanese Patent Application No. 2007-216732, dated May 26, 2010, with English translation.

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