Method of manufacturing electro-optical device

Details Method of manufacturing electro-optical device Method of manufacturing electro-optical device

2009-01-29

2010-06-22

Tran, Long K (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Substrate dicing

C438S022000, C438S030000, C438S462000, C257SE21211, C257SE21221, C257SE21584, C257SE21599

Reexamination Certificate

active

07741137

ABSTRACT:
A method of manufacturing a plurality of electro-optical devices by notching, dicing, and cutting a composite substrate obtained by adhering a first substrate and a second substrate which faces the first substrate with an electro-optical layer interposed therebetween.

REFERENCES:
patent: 2005/0202586 (2005-09-01), Yamanaka et al.
patent: 2008/0254560 (2008-10-01), Yamazaki
patent: 06-048755 (1994-02-01), None
patent: 2006-235010 (2006-09-01), None
patent: 2006-273711 (2006-10-01), None
patent: 03040049 (2003-05-01), None

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