Method of manufacturing electro-optical device

Details Method of manufacturing electro-optical device Method of manufacturing electro-optical device

2005-05-18

2009-02-17

Smith, Zandra (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S033000, C438S110000, C438S118000, C438S458000, C438S460000, C257S777000, C257SE27137, C257SE27144, C257SE27161

Reexamination Certificate

active

07491580

ABSTRACT:
There is provided a method of manufacturing an electro-optical device from a large substrate that is cut into a plurality of first substrates having a chip shape. In the electro-optical device, second substrates of a chip shape are bonded to the first substrates. The method includes adhering a large glass substrate to approximately an entire surface of the large substrate opposite to a surface to which the second substrates are bonded; and cutting both the large substrate and the large glass substrate into first substrate units.

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