Method of manufacturing electrically conductive molded bodies by

Details Method of manufacturing electrically conductive molded bodies by Method of manufacturing electrically conductive molded bodies by

1987-07-02

1989-10-31

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 451, 427105, 427237, 427239, B05D 306, B05D 512, B05D 722

Patent

active

048776424

ABSTRACT:
Layers of electrically conductive material are deposited in a standing microwave field. The deposition is done on an electrically conductive substrate in which a part of the surface forms a part of the inner wall of a microwave cavity resonator. As a result of this the microwave energy is used optimally. Measures are taken to keep the coupling place of the microwave ("window") free from an electrically conductive growth. The substrate is preferably moved periodically or aperiodically relative to the plasma and the remaining walls of the resonator.

REFERENCES:
patent: 4349582 (1982-09-01), Beerwald et al.
patent: 4401054 (1983-08-01), Matsuo et al.
patent: 4473596 (1984-09-01), Beerwald et al.
patent: 4513021 (1985-04-01), Purdes et al.
patent: 4533852 (1985-08-01), Frank et al.
patent: 4585668 (1986-04-01), Asmussen et al.
patent: 4713259 (1987-12-01), Gartner et al.
patent: 4714589 (1987-12-01), Auwerda et al.

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