Method of manufacturing edge connected semiconductor die

Details Method of manufacturing edge connected semiconductor die Method of manufacturing edge connected semiconductor die

1990-10-05

1992-06-30

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437226, 437227, H01L 2128, H01L 21283

Patent

active

051262860

ABSTRACT:
Die bond locations on a semiconductor die are formed as vertical inserts along the edge of the die. The vertical inserts are isolated from substrate and are exposed by a wafer saw process, in which dice are singulated from a wafer. The configuration offers the advantages of a more efficient layout, allowing the entire top surface of the die to be passivated, a better contact configuration, and more convenient assembly for packaging.

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