Chemistry: electrical and wave energy – Processes and products
Patent
1990-01-12
1991-09-17
Beck, Shrive
Chemistry: electrical and wave energy
Processes and products
204 384, 20419214, 427 96, 427 98, C23C 2600
Patent
active
050492446
ABSTRACT:
Disclosed is a method of manufacturing a double-sided wiring substrate wherein fine wiring patterns having a low resistivity are formed on both surfaces of a substrate. An insulating substrate having upper, lower, and side surfaces is prepared. The inner wall of a through hole formed in the insulating substrate or a side edge portion of the substrate is used as the side surface. A thin metal film is formed on the entire surface of the insulating substrate including its side surface by a deposition. The insulating film is covered with a resist film except for a wiring pattern region to be formed, and plating is performed. When the resist film is removed, the thin metal film is exposed outside the wiring patterns formed by the thick metal film. Etching is performed for a short period of time to remove a surface layer of the thick metal film and exposed region of the thin metal film.
REFERENCES:
patent: 3625758 (1971-12-01), Stahl
patent: 3854973 (1974-12-01), Mersereau
patent: 3934335 (1976-01-01), Nelson
patent: 4217182 (1980-08-01), Cross
patent: 4554732 (1985-11-01), Sadlo
patent: 4604799 (1986-08-01), Gurol
patent: 4908094 (1990-03-01), Jones
patent: 4964947 (1990-10-01), Yarita
Kawamura Yoshihiro
Yarita Yoshio
Beck Shrive
Casio Computer Co. Ltd.
Dang Vi Doung
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