Method of manufacturing display device using LED chips...

Details Method of manufacturing display device using LED chips... Method of manufacturing display device using LED chips...

2006-04-20

2010-06-01

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S034000, C438S047000, C257SE21085, C257SE21114, C977S883000, C977S949000

Reexamination Certificate

active

07727788

ABSTRACT:
A method for manufacturing a display device using light emitting diode chips contemplates manufacturing a plurality of light emitting diode (LED) chips using a porous template; forming a plurality of first electrodes on a substrate; attaching the LED chips to pixel sites on the first electrodes using fluidic self assembly (FSA); and forming a plurality of second electrodes on a top surface of the LED chips.

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Korean Office action corresponding to Korean Patent Application No. 10-2006-0025673, issued on Apr. 20, 2007.

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