Method of manufacturing diodes

Details Method of manufacturing diodes Method of manufacturing diodes

1999-07-27

2000-12-12

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438 33, 438106, H01L 2144

Patent

active

061597716

ABSTRACT:
A method of manufacturing diodes includes steps of cutting grooves on a ceramic base to form a plurality of units, each of the grooves being formed with a vertical surface and an inclined surface, applying a layer of conductive cream all over top of each of the units except a portion close to a first edge thereof, adhering a plurality of chips on the units with one of the chips on each of the units, applying green sensing paint to the ceramic base and the chips, letting the green sensing paint to expose, developing the green sensing paint, and then removing film to uncover top of the chips and the grooves, applying a layer of conductive cream all over top of the chips except a portion close to a second edge which is opposite to the first edge, mounting a sheet of glass on top of the units and printing codes thereon, severing the ceramic base into a plurality of elongated rectangular blocks; electroplating both longer vertical sides of the elongated rectangular blocks with silver to form two opposite silver-plated sides, cutting the elongated rectangular blocks into a plurality of diodes, and electroplating an alloy of tin and lead on silver-plated sides of the diodes.

REFERENCES:
patent: 5324586 (1994-06-01), Ueno et al.
patent: 5491111 (1996-02-01), Tai
patent: 5550086 (1996-08-01), Tai
patent: 5712197 (1998-01-01), Sanders et al.
patent: 6008535 (1999-12-01), Jean et al.

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