Method of manufacturing diamond heat sink

Details Method of manufacturing diamond heat sink Method of manufacturing diamond heat sink

1998-02-10

1999-12-28

Klemanski, Helene

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 41, 216 51, 216 56, 216 65, 216 67, 216 81, 257706, 257712, 257930, 438105, 252 70, B44C 122, H01L 2334, H01L 213065

Patent

active

060077301

ABSTRACT:
A diamond polycrystal body having metal films on its upper and lower surfaces is cut in the vertical direction using a laser to form a diamond polycrystal body piece having upper and lower surfaces and a cut surface connecting the upper and lower surfaces. The cut surface may be damaged and include graphite resulting from the laser cutting. To remove the damage and the graphite, the cut surface of the diamond polycrystal body piece is then plasma-treated. Thereby a prescribed degree of electrical insulation between the metallized upper and lower surfaces can be ensured.

REFERENCES:
patent: 5160405 (1992-11-01), Miyauchi et al.
patent: 5294381 (1994-03-01), Iguchi et al.
patent: 5334280 (1994-08-01), Anthony et al.
patent: 5495126 (1996-02-01), Iguchi et al.
patent: 5500393 (1996-03-01), Nishibayashi et al.
patent: 5604037 (1997-02-01), Ting et al.
patent: 5663595 (1997-09-01), Shiomi et al.
patent: 5874775 (1999-02-01), Shiomi et al.
John D. Hunn et al.; Ion beam and laser-assisted micromachining of single-crystal diamond; Solid State Technology, vol. 37, No. 12, Dec. 1994, pp. 57 to 60.

Affiliated with

Also associated with

Rating

Method of manufacturing diamond heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing diamond heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing diamond heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2380146