Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2011-03-22
2011-03-22
Blum, David S (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S464000, C257SE21599
Reexamination Certificate
active
07910459
ABSTRACT:
A method of manufacturing a device, including the steps of forming dividing grooves with a predetermined depth along planned dividing lines of a wafer, then grinding the back-side surface of the wafer to expose the dividing grooves on the back side, dividing the wafer into individual devices, attaching a UV-curable adhesive film to the backside surface of the wafer divided into the individual devices, adhering the adhesive film side of the wafer to a dicing tape attached to an annular frame, radiating UV rays from the face side of the wafer to cure those regions of the adhesive film which correspond to the dividing grooves, radiating a laser beam along the dividing grooves to divide the cured adhesive film on a device basis, and releasing the devices from the dicing tape, thereby picking up the devices.
REFERENCES:
patent: 7341926 (2008-03-01), Nakamura
patent: 2002/0042189 (2002-04-01), Tanaka
patent: 2008/0233712 (2008-09-01), Sekiya
patent: A 2000-182995 (2000-06-01), None
patent: A 2002-118081 (2002-04-01), None
Blum David S
Booker Vicki B
Disco Corporation
Greer Burns & Crain Ltd.
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