Method of manufacturing coreless substrate

Details Method of manufacturing coreless substrate Method of manufacturing coreless substrate

2008-04-08

2008-04-08

Till, Terrence R. (Department: 4175)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S831000, C257S778000

Reexamination Certificate

active

11379059

ABSTRACT:
A method for manufacturing coreless substrates is provided herein. The method first provides a base whose top and bottom sides are covered with metal layers respectively that are detachable from the base. From the two metal layers, the method then develops the bump-pad side or ball side wiring layers required by the coreless substrate simultaneously. The two metal layers along with their respective wiring layers are then separated from the base into two independent semi-products of the coreless substrate. The method then develops from the other sides of the two semi-products the laminate side wiring layers required by the coreless substrate.

REFERENCES:
patent: 6696764 (2004-02-01), Honda
patent: 7093356 (2006-08-01), Imafuji et al.
patent: 7222421 (2007-05-01), Nakamura
patent: 2005/0095748 (2005-05-01), Schulz-Harder
patent: 2005/0155222 (2005-07-01), Nakamura
patent: 2007/0074902 (2007-04-01), Hirata
patent: 2007/0130762 (2007-06-01), Nakamura

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