Method of manufacturing copper foil with insulating layer,...

Details Method of manufacturing copper foil with insulating layer,... Method of manufacturing copper foil with insulating layer,...

2011-04-19

2011-04-19

Goff, John L (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S307100, C156S324000, C427S207100, C427S388100, C427S409000

Reexamination Certificate

active

07927453

ABSTRACT:
To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted “a method of manufacturing a copper foil with an insulating layer1which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer3in an uncured or semi-cured state.

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Pages 9.10 and 9.11 from the “Printed Circuit Board Materials Handbook” by Martin Jawitz 1997.

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