Method of manufacturing cooling blocks for semiconductor lasers

Metal working – Method of mechanical manufacture – Obtaining plural composite product pieces from preassembled...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29424, B23P 1700

Patent

active

043487955

ABSTRACT:
A method of manufacturing cooling blocks for semiconductor lasers, in which the rounding-off radius of the line of intersection between two surfaces of the cooling blocks must have a very small value. In the method, two bodies to be formed into cooling blocks are each provided with a flat surface and these bodies are secured together with their flat surfaces by means of a curable adhesive. One side of the bodies connected together is subjected, transverse to the two surfaces connected together, to a machining treatment so as to obtain a further flat surface, in which machining treatment deformation and burring of the bodies near the line of intersection to be formed is avoided due to the presence of the cured adhesive, and a line of intersection having a rounding-off radius of only a few microns is formed.

REFERENCES:
patent: 2762954 (1956-09-01), Leifer
patent: 3149407 (1964-09-01), Stockton et al.
patent: 3165824 (1965-01-01), Barney
patent: 3613228 (1971-10-01), Cook et al.
patent: 3685110 (1972-08-01), Randolph
patent: 4268946 (1981-05-01), Eisenberg

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing cooling blocks for semiconductor lasers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing cooling blocks for semiconductor lasers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing cooling blocks for semiconductor lasers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2149825

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.