Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2005-10-07
2010-10-19
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S113000, C438S406000, C438S455000, C438S459000
Reexamination Certificate
active
07816233
ABSTRACT:
The invention provides a method of manufacturing a composite wafer structure. In particular, the method, according to the invention, is based on the fracture mechanics theory to actively control fracture induced during the manufacture of the composite wafer structure and to further protect from undesired edge damage. Thereby, the method, according to the invention, can enhance the yield rate of industrial mass production regarding the composite wafer structure.
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Ho Ya-Lan
Hsu Sung-Lin
Hsu Wen-Ching
Huang Jing-Yi
Wang Jung-Tsung
Garcia Joannie A
Richards N Drew
Sino-American Silicon Products Inc.
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