Method of manufacturing component-embedded printed circuit...

Details Method of manufacturing component-embedded printed circuit... Method of manufacturing component-embedded printed circuit...

2008-04-22

2010-06-08

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S830000, C029S832000, C029S025420, C361S323000, C174S260000

Reexamination Certificate

active

07730612

ABSTRACT:
A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

REFERENCES:
patent: 7350296 (2008-04-01), Ryu et al.
patent: 2001/0027605 (2001-10-01), Nabemoto et al.
patent: 2003/0221864 (2003-12-01), Bergstedt et al.
patent: 2005/0048759 (2005-03-01), Hsu

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