Method of manufacturing circuit module

Details Method of manufacturing circuit module Method of manufacturing circuit module

1995-02-16

1996-12-10

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29837, 29843, 29845, 174255, 2281801, 361753, H05K 334, H05K 714

Patent

active

055818757

ABSTRACT:
An electronic component is mounted on one major surface of a dual side wiring substrate. A terminal is press-fitted into a mounting hole in the dual side wiring substrate from the one major surface side to be temporarily fixed in the substrate, and an electronic component is mounted on the other major surface of the dual side wiring substrate after soldering paste is applied. A frame having a plurality of bent pieces extending inwardly is mounted onto the dual face wiring substrate from a position above the substrate so that the bent pieces abut against the pattern of the dual side wiring substrate. The terminal press-fitted from the one major surface side, the electronic component mounted on the other major surface, and the frame are soldered simultaneously by a reflow method.

REFERENCES:
patent: 4809057 (1989-02-01), Ocken
patent: 5085362 (1992-02-01), Art et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5184283 (1993-02-01), Hamel
patent: 5408207 (1995-04-01), Chanteau

Affiliated with

Also associated with

Rating

Method of manufacturing circuit module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing circuit module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing circuit module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-416820