Method of manufacturing circuit module

Details Method of manufacturing circuit module Method of manufacturing circuit module

1997-01-29

1999-05-25

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

26427214, H01L 2331

Patent

active

059067004

ABSTRACT:
A bare chip is mounted on a land of a substrate, and electrodes on an upper surface of the bare chip are connected with pads by means of wires. The pads are formed in lines so as to face the land, and electrodes for the soldering of electrodes of rectangular electronic parts are formed in the empty spaces between the vertical and horizontal lines of pads. After soldering the rectangular electronic parts, the bare chip is mounted and then sealed with resin. The rectangular electronic parts soldered between the lines of pads are entirely or partly sealed with the resin as well as the bare chip. The rectangular electronic parts are mounted in the spaces between the lines of pads, and therefore the bare chip and the rectangular electronic parts can be mounted at a higher density so that the substrate can be made smaller and more compact.

REFERENCES:
patent: 5232651 (1993-08-01), Okuno et al.

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