Method of manufacturing circuit device

Details Method of manufacturing circuit device Method of manufacturing circuit device

2006-04-11

2006-04-11

Guerrero, Maria F. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S107000, C438S108000, C438S110000, C438S111000, C438S112000, C438S113000

Reexamination Certificate

active

07026190

ABSTRACT:
Wire bonding is performed efficiently by pressing circumference end of a block of a conductive foil by a clamper, and by performing wire bonding of a circuit element of a mounting portion in the block and the conductive pattern in a lump. At a time of wire bonding, oxidation of the conductive foil is prevented by blowing nitrogen gas to the conductive foil from paths and provided at the clamper.

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