Method of manufacturing circuit device

Details Method of manufacturing circuit device Method of manufacturing circuit device

2005-03-08

2005-03-08

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

06864121

ABSTRACT:
A conductive pattern of a first layer isolated by an isolation trench is formed on a conductive foil, and a plurality of layers of the conductive patterns are formed thereon to create a multilayered wiring structure, and furthermore, a circuit element is mounted and molded with an insulating resin and the back surface of the conductive foil is etched. It is possible to implement a method of manufacturing a circuit device which provides very power saving and is suitable for mass production, then the circuit device having conductive patterns of a multilayered structure are provided.

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U.S. patent application Ser. No. 09/944,322, Sakamoto et al., filed Mar. 7, 2002.
U.S. patent application Ser. No. 10/010,890, Sakamoto et al., filed Sep. 26, 2002.

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