Method of manufacturing circuit board used for switch device

Details Method of manufacturing circuit board used for switch device Method of manufacturing circuit board used for switch device

2011-04-12

2011-04-12

Ahmed, Shamim (Department: 1713)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S018000, C216S088000, C029S846000, C029S849000, C174S250000

Reexamination Certificate

active

07922918

ABSTRACT:
There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 μm and a gold layer having a thickness of about 0.01 to about 0.5 μm on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.

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Search Report issued in corresponding European Patent Application No. 07 02 0024; issued Jul. 1, 2009.

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