Method of manufacturing circuit board and communication...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S825000, C029S848000, C029S849000

Reexamination Certificate

active

06898850

ABSTRACT:
A method of manufacturing a circuit board by forming a circuit pattern in a short process and capable of performing pattern transfer with stability. The manufacturing method includes a step of superposing on a carrier a resist layer in which a circuit pattern is formed and which is formed of a conductor or an insulator, a step of filling the circuit pattern with an electroconductive material, a step of removing the resist layer from the carrier, and a step of transferring the electroconductive material filled in the circuit pattern into an electrical insulating material.

REFERENCES:
patent: 4604160 (1986-08-01), Murakami et al.
patent: 5197184 (1993-03-01), Crumly et al.
patent: 5358604 (1994-10-01), Lin et al.
patent: 6143116 (2000-11-01), Hayashi et al.
patent: 2001/0023779 (2001-09-01), Sugaya et al.
patent: 2003/0102153 (2003-06-01), Sugaya et al.
patent: 10-107445 (1998-04-01), None
patent: 2002-204049 (2002-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing circuit board and communication... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing circuit board and communication..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing circuit board and communication... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3377274

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.