Method of manufacturing circuit board

Details Method of manufacturing circuit board Method of manufacturing circuit board

2007-10-16

2007-10-16

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000

Reexamination Certificate

active

10535158

ABSTRACT:
A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.

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