Method of manufacturing circuit board

Details Method of manufacturing circuit board Method of manufacturing circuit board

2006-05-23

2006-05-23

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S845000, C029S846000, C029S852000, C029S855000, C174S255000, C361S803000

Reexamination Certificate

active

07047629

ABSTRACT:
A circuit board manufacturing method including the steps of forming a through hole on an insulator layer and then filling the through hole with a conductive paste; dispersing and forming a protective agent on an adhesion surface of a conductor foil so as to include adhesion surface regions where the protective agent does not exist; sticking the conductor foil to the insulator layer; and abutting a plurality of conductive powders constituting the conductive paste and the conductor foil to each other through the adhesion surface regions by means of heating and pressurizing the insulator layer and conductor foil.

REFERENCES:
patent: 3644166 (1972-02-01), Gause
patent: 4086095 (1978-04-01), McLeod
patent: 4967314 (1990-10-01), Higgins, III
patent: 5021296 (1991-06-01), Suzuki et al.
patent: 5309629 (1994-05-01), Traskos et al.
patent: 5481795 (1996-01-01), Hatakeyama et al.
patent: 6096411 (2000-08-01), Nakatani et al.
patent: 6440542 (2002-08-01), Kariya
patent: 6488869 (2002-12-01), Takezawa et al.

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