Method of manufacturing circuit board

Details Method of manufacturing circuit board Method of manufacturing circuit board

2011-05-10

2011-05-10

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S846000, C174S261000

Reexamination Certificate

active

07937833

ABSTRACT:
A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.

REFERENCES:
patent: 2692190 (1954-10-01), Pritikin
patent: 5712080 (1998-01-01), Satsu et al.
patent: 6815709 (2004-11-01), Clothier et al.
patent: 2004-247391 (2004-09-01), None
Japanese Office Action issued Jan. 8, 2010 in corresponding Japanese Patent Application 2007-271056.

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