Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1991-05-22
1993-01-05
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 228203, 228219, 22826312, 29846, H05K 300, H05K 302
Patent
active
051763095
ABSTRACT:
According to this invention, there is provided a method of manufacturing a highly reliable circuit board in which a copper member is strongly, directly bonded to a substrate made of an aluminum nitride sintered body, thereby obtaining high peel strength. The method of manufacturing the circuit board includes the steps of bringing a copper member containing 100 to 1,000 ppm of oxygen into contact with an oxide layer having a thickness of 0.1 to 5 .mu.m formed on a surface of a substrate made of an aluminum nitride sintered body, and heating the substrate in an inert gas atmosphere containing 1 to 100 ppm of oxygen at a temperature not more than a temperature corresponding to a liquidus including a pure copper melting point of a hypoeutectic region of a two-component phase diagram of Cu-Cu.sub.2 O and not less than a temperature corresponding to a eutectic line obtained by connecting a line corresponding to copper and a line corresponding to a cuporus oxide composition, and directly bonding the copper member to the substrate.
REFERENCES:
patent: 3744120 (1973-07-01), Burgess et al.
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4129243 (1978-12-01), Cusano et al.
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4693409 (1987-09-01), Mizunoya et al.
patent: 4849292 (1989-07-01), Mizunoya et al.
Endo Mitsuyoshi
Horiguchi Akihiro
Kasori Mitsuo
Komorita Hiroshi
Ueno Fumio
Heinrich Samuel M.
Kabushiki Kaisha Toshiba
LandOfFree
Method of manufacturing circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2386914