Method of manufacturing circuit board

Details Method of manufacturing circuit board Method of manufacturing circuit board

1990-10-01

1991-11-19

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 524, 21912169, 21912171, H05K 330

Patent

active

050655060

ABSTRACT:
A method of manufacturing a circuit board, comprising the steps of providing an electric conductor on one surface of a substrate made of flexible synthetic resin and selectively irradiating a laser beam onto the substrate from the other surface of the substrate so as to sublimate a portion of the substrate such that an opening is formed on the substrate, with the electric conductor traversing the opening.

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 3763404 (1973-10-01), Aird
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3984739 (1976-10-01), Mochizuki et al.
patent: 4644130 (1987-02-01), Bachmann
IBM Technical Discl Bull, vol. 8, No. 3, Aug. 1965, p. 434, by Kremen.
IBM Technical Discl Bull, vol. 11, No. 9, Feb. 1969, p. 1151, by Smith et al.
IBM Technical Discl Bull, vol. 22, No. 4, Sep. 1979, p. 1417, by Howrilker et al.

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