Method of manufacturing chip-size package-type semiconductor dev

Details Method of manufacturing chip-size package-type semiconductor dev Method of manufacturing chip-size package-type semiconductor dev

1996-10-17

1998-06-02

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438125, 438401, 438462, 29 2501, H01L 2144, H01L 2148, H01L 2150

Patent

active

057598738

ABSTRACT:
In a method of manufacturing a chip size semiconductor device comprising a semiconductor chip and a carrier tape including an insulating film and wiring patterns formed on one surface of the insulating film, the method comprises the steps of bonding the semiconductor chip and the carrier tape by the use of an adhesive film having a predetermined size corresponding to an adhesive area of the semiconductor chip. The step of bonding comprises the substeps of cutting away the adhesive film by punching from an adhesive film tape held above the semiconductor chip mounted on a table and subsequently setting the adhesive film on the adhesive area by moving the adhesive film downwardly.

REFERENCES:
patent: 4740136 (1988-04-01), Asai et al.
patent: 4829663 (1989-05-01), Masujima et al.

Affiliated with

Also associated with

Rating

Method of manufacturing chip-size package-type semiconductor dev does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing chip-size package-type semiconductor dev, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing chip-size package-type semiconductor dev will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1458922