Method of manufacturing chemically adsorbed film

Coating processes – Electrical product produced – Welding electrode

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427 44, 427302, 427322, 427327, 427352, 427436, 4274432, B05D 312

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active

051437503

ABSTRACT:
According to the invention, a chemically adsorbing material is reacted with a substrate surface having active hydrogen groups by dipping the substrate into a solution of the chemically adsorbing material simultaneous and applying ultrasonic waves to the solution. In this way, a high concentration monomolecular and/or polymer film substantially free from pin holes can be formed in a short period of time. That is, while the ultrasonic waves are applied, a chemical adsorbing material having an end functional chlorosilyl group is adsorbed onto the substrate surface, thereby forming a chemically adsorbed monomolecular and/or polymer film. The frequency of the ultrasonic waves are suitably in a range of 25 to 50 kHz. In addition, after formation of the adsorbed film, the substrate is washed for making monomolecular film by dipping it in a washing solution while applying ultrasonic waves. In this way, non-reacted chemical adsorbing material remaining on the substrate can be efficiently washed away.

REFERENCES:
patent: 4539061 (1985-09-01), Segiv
patent: 4863794 (1989-09-01), Fujii
World Patents Index Latest, Derwent Publications Ltd., London, GB; AN 86-065417 & JP-A-61 016 910 (Hitachi Cable KK), Jan. 24, 1986 (abstract).

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