Method of manufacturing ceramic multilayer circuit component and

Details Method of manufacturing ceramic multilayer circuit component and Method of manufacturing ceramic multilayer circuit component and

1994-10-17

1996-11-12

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 89, 156247, 156252, 156278, 156344, B32B 3104

Patent

active

055736203

ABSTRACT:
Before ceramic green sheets formed on carrier films, which are prepared for manufacturing a ceramic multilayer circuit board, are stacked with each other, each carrier film is separated from each ceramic green sheet, which is maintained in a state being attracted by an attracting head. This separation is rendered to gradually extend over the entire region from an end of the ceramic green sheet.

REFERENCES:
patent: 5316602 (1994-05-01), Kogame et al.
British Examination Report on British Patent Application No. GB 9400551.9; Feb. 12, 1996.

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