Method of manufacturing bendable solid state lighting

Details Method of manufacturing bendable solid state lighting Method of manufacturing bendable solid state lighting

2011-01-18

2011-01-18

Ngo, Ngan (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S034000, C257SE21705

Reexamination Certificate

active

07871836

ABSTRACT:
The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.

REFERENCES:
patent: 7303315 (2007-12-01), Ouderkirk et al.
patent: 7360924 (2008-04-01), Henson et al.
patent: 2005/0116235 (2005-06-01), Schultz et al.
patent: 2006/0091524 (2006-05-01), Karashima et al.
patent: 2007/0080438 (2007-04-01), Yamanaka et al.
patent: 2008/0067526 (2008-03-01), Chew

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