Method of manufacturing ball grid array semiconductor package

Details Method of manufacturing ball grid array semiconductor package Method of manufacturing ball grid array semiconductor package

1998-01-26

2000-02-01

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438123, 438126, H01L 2144

Patent

active

060202181

ABSTRACT:
Provided with a method of manufacturing a ball grid array semiconductor package using a flexible circuit board strip, which is directed to prevent minute conductive traces in the outer part of a circuit pattern formed in the flexible circuit board and thus minimize the short-circuits by forming notches on the flexible circuit board in the vicinity of the lower side ends of a resin encapsulant section by use of a punch, and pressing down the resin encapsulant section with a singulation tool to remove the carrier frame and separate the ball grid array semiconductor packages in the piece.

REFERENCES:
patent: 5262351 (1993-11-01), Bureau et al.
patent: 5289346 (1994-02-01), Carey et al.
patent: 5426072 (1995-06-01), Finnila
patent: 5474957 (1995-12-01), Urushima
patent: 5527741 (1996-06-01), Cole et al.
patent: 5548099 (1996-08-01), Cole, Jr. et al.

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