Method of manufacturing and using alignment marks

Details Method of manufacturing and using alignment marks Method of manufacturing and using alignment marks

1997-07-10

1999-08-24

Bowers, Charles

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

H01L 2176

Patent

active

059435887

ABSTRACT:
A method and apparatus for using alignment marks to locate buried structures in integrated circuits is provided. An alignment mark is used to locate a circuit area to be operated on. Underlying features of the circuit area are located based on the known location of the alignment marks. These underlying features are then operated on.

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