Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
1998-07-21
2001-07-24
Young, Lee (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S832000, C029S837000
Reexamination Certificate
active
06263563
ABSTRACT:
Invention relates to electronic technique, particularly, to the technology of fabrication semiconductor integrated circuits.
Creating the electronic components conventionally includes besides manufacture of semiconductor structure very labor-consuming processes- burn-in and final inspection of manufactured dice after their packaging. The cost of these processes often many times exceeds the cost of IC dice manufacture. Necessity of contacting sockets applying additionally aggravate situation, because it makes necessary to produce these thousands complicated devices using precious metals but having low reliability.
It is know technical decision in the international claim WO 91/10259 HO1L 21/66 dt. Dec. 26, 1989. <<Testable ribbon bonding method and wedge bonding for microcircuit device fabrication>>.
An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons ,using a bonding merge that forms the lead wires into a gull-wiring shape with central portions thereof formed adjacent to portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining attached lead wire portions is removed from the test substrate. The lead wires are sufficiently stiff and or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate. The components is then adhered to a permanent device substrate, and the ends of the lead wires are bonded to corresponding contacts on the device substrate.
It is also known decision in Europatent EP0287451 HOL 21/66 (Oct. 19, 1988) <<Method and device for connection and Mounting Electronic Component During Tests>>.
The method provides component's connection with a frame, disposed around a periphery of component by the means of wire conductors.
The component's test is made by connecting test equipment with the said frame. After testing the component is being mounted in a substrate, and component's connection with the substrate is implemented by conductors, connecting the components with the frame. After the connection the conductors are cut between bonding pads on the substrate and the frame. After it the frame is removed.
Both said above methods allow to make group IC dice checking before a final packaging. A shortcoming of these methods is that they don't decide a problem of burn in process, additionally it is necessary to provide preliminary contacting leads with the bounding pads of the die, that is labor-consuming consecutive operation.
Constructive decision in U.S. Pat. No. 3,725,744 HO5K 1/04 (Jun. 11, 1971) <<Electical Component Connector Assembly>> allows not only to check electronic components, but to use the construction as 3-D modules assembly.
An assembly for electrically connecting various miniaturized electrical components is disclosed and generally includes a planar surface, such as a motherboard, which supports the electrical components as well as at least one thin insulating strip lying in a plane extending perpendicular to the surface and defining a plurality of apertures arranged in accordance with a predetermined circuit plan. A plurality of spaced-apart electrically conductive posts and at least one electrically conductive rail are mounted on opposite sides of the insulating strip and extend in transverse directions so as to cross the aforesaid apertures in accordance with the predetermined plan. In this manner, preselected posts are welded to preselected rails through commonly crossed apertures, and are also electrically connected to the various electrical components which thereby connect these components together in accordance with the aforestated predetermined circuit plan.
Shortcomings of this method are labor-consuming of electronic components primary mounting and complexity of extracting the defected component.
It is known also a technical decision in U.S. Pat. No. 4,996,630 HO5K 1/11 (Jun. 22, 1993) <<Hybrid Module Electronics Package>>.
A very Large Hybrid Module for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components
The said technical decision is oriented, mainly, to a creating hybrid IC, but it can be used for unpackaged component's checking before a hermetic lid mounting.
The being proposed <<Method of Manufacturing and Checking Electronic Components>> consists, in particular, in that the burn-in is processed simultaneously for all the dice, preliminarily molded in press-form. A group metal frame with the leads for each die can be disposed in the press-form, the frame is fixed simultaneously with the dice forming the group carrier.
Implementation of burn-in and checking according to the invention of all dice simultaneously allows significantly decrease the duration of assembling and checking electronic component.
Above mentioned technical decisions in Europatent 0287451 and international claim WU 91/10259 are the most like to the being claimed <<Method of Manufacturing and Checking Electronic Components>>.
The present invention consists in that in the method of manufacturing and checking electronic components, including disposal the plurality of dice on the group carrier, electrical connection with it, implementation the group burn-in and checking of the dice and further extracting the good dice from the group carrier, according to the invention, the dice are disposed inside the press-form, orienting to their bonding pads and base elements of the press-form; the dice are fixed one to another mainly using a polymeric material, creating the group carrier, at the same time providing a disposal of main dice surfaces on the common plane with one of the group carrier surfaces; an insulating layer is deposited to all electrically non-protected the dice zones: conductors, connecting the bonding pads of the dice with external contacts, conductors, connecting the dice one to another and with external connector are deposited simultaneously to the common surface of the group carrier and dice, these conductors providing the implementation of the burn-in and checking simultaneously form the external connector of the group carrier; the good dice together with separate zones of the carrier are detached from the group carrier, and then obtained electronic component is housed into package.
It is possible to dispose simultaneously to the press-form not only the dice, but additionally a group metal frame with leads for every die, the frame in this case is fixed simultaneously with the dice forming the group carrier, besides it the frame's leads are disposed on the same plane with the main surfaces of dice. In order to make further operations windows with opening the frame's leads, intended for further connection with the dice bounding pads are provided in the group carrier, and also windows with opening and further removing parts of the group frame, locking external contacts of components are formed in the carrier too. Moreover, in this case there is a danger of components damage by a static electricity. Therefore, all further operations must be implemented using protection of the static electricity (electrostatic discharge). After these operations good components are detached from the group carrier, the external leads are moulded, hermetization using polymeric material is made, and the components are used as integrated circuits (IC), housed in polymeric (epoxy) packages.
A variant, when the group frame is not applied, is possible too. In this ca
Birch & Stewart Kolasch & Birch, LLP
R-Amtech International, Inc.
Smith Sean
Young Lee
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