Method of manufacturing and assembling an integrated circuit car

Details Method of manufacturing and assembling an integrated circuit car Method of manufacturing and assembling an integrated circuit car

1996-07-08

1998-12-22

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29840, 29852, 174 522, 22818021, 235492, 257679, 26427215, 26427217, 361764, H05K 334, H05K 1304, H01L 2156, H01L 2328

Patent

active

058506900

ABSTRACT:
In a first step, electrical conductor tracks (15 to 20) are applied against the bottom and the walls of a cavity (5) for the integrated circuit (IC4) and connected to external contact pads (2) at the same side of the card. Said tracks lie alternately side-by-side at the bottom 7 of the cavity. In a second step, the IC (4) is glued with its surface which does not carry the contacts on said tracks on the bottom (7) of the cavity by means of a non-conducting glue. Then connections are realized by soldering of conductor wires (12) between contacts of the IC and ends of the tracks, and the cavity is filled with a protective resin. Application: Placement of an IC with inverted contacts in an electronic card support.

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patent: 5264990 (1993-11-01), Venambre
patent: 5283423 (1994-02-01), Venambre et al.
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