Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-11-13
2010-12-14
Zameke, David A (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S126000, C438S118000, C257SE21503
Reexamination Certificate
active
07851258
ABSTRACT:
A method of manufacturing an RFID tag that includes forming an antenna pattern and a reinforcing layer on one surface of a film made of a resin material, applying a thermosetting adhesive onto the reinforcing layer and the antenna pattern, mounting a circuit chip on the antenna pattern via the thermosetting adhesive, pinching the circuit chip and the other surface of the film, and fixing the circuit chip to the antenna pattern by hardening the thermosetting adhesive. The reinforcing layer is formed within a region where the circuit chip is mounted and the circuit chip includes a first protrusion contacting the antenna pattern and a second protrusion contacting the reinforcing layer.
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Extended European Search Report, mailed Sep. 3, 2009 and issued in corresponding European Patent Application No. 07121154.4-2214.
Fujitsu Limited
Greer, Burns and Crain, Ltd.
Zameke David A
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