Method of manufacturing an optoelectronic package

Details Method of manufacturing an optoelectronic package Method of manufacturing an optoelectronic package

2007-02-20

2007-02-20

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S848000, C029S850000, C029S855000, C029S856000, C029S862000, C156S209000, C156S307100, C174S522000, C257S793000, C264S162000, C264S272150, C264S272170, C385S051000, C385S094000

Reexamination Certificate

active

10725566

ABSTRACT:
A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

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