Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-05-22
1993-06-08
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29841, 437 3, 437211, 1562739, 1562753, 1562755, 1562757, H05K 334
Patent
active
052168050
ABSTRACT:
An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical element. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.
REFERENCES:
patent: 3622419 (1971-11-01), London et al.
patent: 3820237 (1974-06-01), Effer
patent: 4610746 (1986-09-01), Broer et al.
patent: 4662735 (1987-05-01), Karasaki et al.
Hallenbeck Gary A.
Janson, Jr. Wilbert F.
Jones William B.
Bryant David P.
Eastman Kodak Company
Echols P. W.
Hall David
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