Method of manufacturing an optoelectronic device

Fishing – trapping – and vermin destroying

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H01L 21223

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active

055061869

ABSTRACT:
The invention relates to a method of manufacturing an optoelectronic device. An indium phosphide part of a semiconductor body is contacted either directly or indirectly through a ternary or quaternary layer by means of a zinc diffusion. In order to improve the contact resistance, after the zinc diffusion and before the application of contacts, a heat treatment of the semiconductor body is carried out in the absence of a zinc source.

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Colclaser, R., Microelectronics: Processing and Device Design, John Wiley & Sons, 1980, pp. 135 & 140.
Matsumoto, Y., Diffusion of Cd and Zn in InP and InGaAsP, Japanese Journal of Applied Physics, vol. 22, No. 11, Nov. 1983, pp. 1699-1704.
Yamada, M., Double zinc diffusion fronts in InP-Theory and Experiment, Appl. Phys. Lett. 43(6), 15 Sep. 1983, pp. 594-596.
Ando, H., Low-temp. Zn and Cd diffusion Profiles in InP and Formation of Guard Ring in InP. IEEE Trans. on Elect. Devices, vol. ED-29, Avalanche Photodiodes, No. 9, Sep. 1982, pp. 1408-1413.

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