Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-05-06
2008-05-06
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S099000, C438S126000, C257SE33059, C313S506000
Reexamination Certificate
active
11146865
ABSTRACT:
A method of manufacturing an OLED device with a curved light-emitting surface comprising:a) forming a flexible substrate and providing the flexible substrate in a flat configuration;b) forming one or more OLEDs having a first electrode, one or more layers of organic material, at least one of which is light emitting formed over the first electrode, and a second electrode formed over the one or more layers of organic material, on the substrate;c) forming a rigid, curved, encapsulating cover;d) conforming the flexible substrate, electrodes, and one or more layers of organic material to the rigid, curved, encapsulating cover; ande) sealing the conformed flexible substrate, electrodes, and one or more layers of organic material to the rigid, curved, encapsulating cover.
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Anderson Andrew J.
Eastman Kodak Company
Shaw Stephen H.
Smoot Stephen W.
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