Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2007-09-11
2007-09-11
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S030000, C438S106000, C257SE25032, C257SE21053, C257SE21352
Reexamination Certificate
active
11098870
ABSTRACT:
The present invention related to a method of manufacturing an LED, including the steps of: first, forming a tape coppery metal strip; then, continuously pressing circuits on the tape coppery metal strip so as to form a carrier having circuit patterns of electric contacts on which the diode dies can be placed; next, electroplating a plurality of metal layers on the surface of the carrier; then, performing continuous injection molding on the carrier so as to form a protector having a designated shape; and curing and fixing the diode die on the carrier to connect to the terminal contact of the carrier via metal wire. A conductive or non-conductive adhesive is dropped onto the bonding position between the metal wire and the terminal of the carrier, and a soft paste is Anther applied to cover the diode die, the metal wire and the terminal.
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Kingbright Electronic Co., Ltd.
Nhu David
Patterson Thuente Skaar & Christensen P.A.
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