Method of manufacturing an interlayer via and a laminate precurs

Details Method of manufacturing an interlayer via and a laminate precurs Method of manufacturing an interlayer via and a laminate precurs

1998-11-06

2000-09-19

Gulakowski, Randy

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

430313, 430317, 430318, 430319, G03C 500

Patent

active

061206938

ABSTRACT:
A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.

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patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5672760 (1997-09-01), Burns et al.

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