Method of manufacturing an interconnect device having coplanar c

Details Method of manufacturing an interconnect device having coplanar c Method of manufacturing an interconnect device having coplanar c

1990-10-23

1991-12-17

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29874, 29877, 29884, 156630, 156634, 156656, H01K 310

Patent

active

050725203

ABSTRACT:
An interconnect or circuit device having coplanar contact bumps, and the method of manufacture thereof are presented. The coplanar contact bumps are formed against a flat reference surface whereby the resulting bumps have coplanar means.

REFERENCES:
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4236777 (1980-12-01), Merlina et al.
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4722765 (1988-02-01), Anbros et al.

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