Method of manufacturing an interboard connection terminal

Details Method of manufacturing an interboard connection terminal Method of manufacturing an interboard connection terminal

1988-03-25

1990-02-06

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29840, H05K 111

Patent

active

048979180

ABSTRACT:
A stack layer structure is formed wherein solderable metal layers are provided at least at two ends thereof, and at least a metal layer for preventing the diffusion of solder is inserted between the two metal layers. In an interboard connection terminal and a method of manufacturing the same, a pair of solder bumps are fixed to be in contact with the two surfaces of the resultant stack layer structure.

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