Method of manufacturing an integrated thin film head

Details Method of manufacturing an integrated thin film head Method of manufacturing an integrated thin film head

2007-01-30

2007-01-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603130, C029S603140, C029S847000, C216S022000, C216S040000, C216S041000

Reexamination Certificate

active

11087510

ABSTRACT:
A method of manufacturing an integrated thin film head comprises, in order to prevent short-circuit among the lead layer, upper lead layer and shield layers, a lower shield layer formed on a substrate, a lower readgap layer formed on the lower shield layer, an MR sensor layer formed on the lower readgap layer, a lead layer jointed with the MR sensor layer, an upper lead layer formed in contact with a part of the lead layer, an upper readgap layer formed to cover the MR sensor layer, lead layer and upper lead layer and an upper shield layer formed on the upper readgap layer. The part of the lead layer in contact with the upper lead layer is formed thinner than the part not contact with the upper lead layer.

REFERENCES:
patent: 3731007 (1973-05-01), Masuda et al.
patent: 5141623 (1992-08-01), Cohen et al.
patent: 5653013 (1997-08-01), Gill et al.
patent: 5764446 (1998-06-01), Seagle
patent: 5792546 (1998-08-01), Kanamine et al.
patent: 5907459 (1999-05-01), Shouji et al.
patent: 6219207 (2001-04-01), Pinarbasi
patent: 6252749 (2001-06-01), Hayakawa
patent: 6453542 (2002-09-01), Zhu
patent: 6570743 (2003-05-01), Garfunkel et al.
patent: 2-142195 (1990-05-01), None
patent: 6-333215 (1994-12-01), None
patent: 11-238211 (1999-08-01), None
Xiao et al., “Fabrication and Characterization of Continuous Permanent Magnet Junctions”, IEEE Transactions on Magnetics, vol. 34, No. 4, Jul. 1998, pp. 1495-1497.

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